| 摘要 |
<p>A cover (6) for a semiconductor package consists of a plate of ceramic material, and has on its upper surface one or more openings for individually receiving terminals (26-34). Hollow truncated cylindrical-like cups (14-18) each have a closed top portion with an opening for receiving an end of a threaded mounting stud (19-23), and an open bottom portion for mounting the cup over a terminal hole in the plate. The cups are each filled with a plurality of solder-coated pellets (38) prior to mounting on the plate. The plate is then secured to the open top of the semiconductor package in a manner such that terminals protruding from the interior of the package pass through the holes in the plate and into the interior of the overlying cups, whereby the pellets provide electrical contact between the terminal and the end of the mounting stud protruding into the interior of the associated cup. The cups are heated to melt the solder on the pellets, for fusing the same to one another, to the terminal, and to the end of the threaded stud, for insuring a rigid mechanical and electrical connection therebetween. <IMAGE></p> |
