SEMICONDUCTOR DEVICE HAVING MANY LEAD PINS.

摘要

A semiconductor device with a high package lead density such as the PGA type, allowing the density of the semiconductor device to increase by forming the leads of the semiconductor device with lead pins (14) for surface mounting arranged by the specified quantity at the outer peripheral area on the back of a package (13) where a chip (11) is mounted and lead members (22 and 41) having the predetermined function at least one of which is arranged at the internal area other than the area of the above lead pins (14).