发明名称 |
HARD MATERIAL CLAD WITH DIAMOND, THROWAWAY CHIP, AND METHOD OF MAKING SAID MATERIAL AND CHIP. |
摘要 |
<p>A diamond-clad hard material having high adhesion strength to a base material and a diamond-clad throwaway chip capable of cutting various kinds of light metals such as Al-Si alloy at high speed for along period of time, wherein the diamond-clad hard material is composed of a material to be sintered which is constituted mainly of Si3N4, has a sintered skin at least at a part thereof, and is clad with diamond at least at said sintered skin; and the throwaway chip is commposed of a base material constituted mainly of Si3N4 and a clad layer in thickness of 0.1 SIMILAR 200 mu m of diamond or/and diamond-like carbon vapor-deposited on the surface of the base material and is characterized by being clad with a layer of diamond or/and diamond-like carbon partly or entirely on the surface having a sintered skin property of the base material thereof: thereby effectively achieving the object. <IMAGE></p> |
申请公布号 |
EP0504424(A1) |
申请公布日期 |
1992.09.23 |
申请号 |
EP19910917335 |
申请日期 |
1991.10.04 |
申请人 |
SUMITOMO ELECTRIC INDUSTRIES, LTD. |
发明人 |
OMORI, NAOYA, ITAMI WORKS OF SUMITOMO;NOMURA, TOSHIO, ITAMI WORKS OF SUMITOMO |
分类号 |
B23B27/14;B23B51/00;B23B51/02;B23B51/04;C04B41/50;C04B41/85;C23C16/02;C23C16/27 |
主分类号 |
B23B27/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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