发明名称 Method for plating palladium
摘要 A method for plating palladium on Group IV-B and V-B metals, particularly niobium, vanadium, zirconium, titanium and tantalum as pure metals and as alloys is described. The method provides the metal to be plated with a roughened exposed surface to be plated which has been electrolytically hydrided and then the surface is plated using electroless or electrolytic plating. Hydride is removed from the plated surface, usually by heating. This also removes other surface impurities and aids the coat adhesion. The resulting palladium plated metal articles are usful for hydrogen extraction.
申请公布号 US5149420(A) 申请公布日期 1992.09.22
申请号 US19900553550 申请日期 1990.07.16
申请人 BOARD OF TRUSTEES, OPERATING MICHIGAN STATE UNIVERSITY 发明人 BUXBAUM, ROBERT E.;HSU, PETER C.
分类号 C25D3/50;C25D5/38 主分类号 C25D3/50
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