发明名称 EPOXY RESIN COMPOSITION
摘要 PURPOSE:To obtain the title composition excellent in toughness and heat resistance, suitable for laminates and various kinds of molding material by incorporating an epoxy resin with a specified amount of a specific copolymer. CONSTITUTION:The objective composition can be obtained by incorporating (A) 70-99wt.% of an epoxy resin with (B) 1-30wt.% of a copolymer 10000-1000000 in average molecular weight made up of (1) 10-90mol% of a structural unit of formula I (R1 is H, halogen or methyl; R2 is H, halogen, aliphatic saturated or unsaturated hydrocarbon, etc.) and (2) 10-90mol% of another structural unit of formula II (R3 and R4 are each H, halogen or methyl; R5 is H, halogen, alkyl, etc.).
申请公布号 JPH04266960(A) 申请公布日期 1992.09.22
申请号 JP19910026457 申请日期 1991.02.20
申请人 NIPPON SHOKUBAI CO LTD 发明人 TOMOI MASAO;IIJIMA TAKAO
分类号 C08L63/00;C08G59/00;C08L35/00 主分类号 C08L63/00
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