摘要 |
PURPOSE:To obtain the title composition excellent in toughness and heat resistance, suitable for laminates and various kinds of molding material by incorporating an epoxy resin with a specified amount of a specific copolymer. CONSTITUTION:The objective composition can be obtained by incorporating (A) 70-99wt.% of an epoxy resin with (B) 1-30wt.% of a copolymer 10000-1000000 in average molecular weight made up of (1) 10-90mol% of a structural unit of formula I (R1 is H, halogen or methyl; R2 is H, halogen, aliphatic saturated or unsaturated hydrocarbon, etc.) and (2) 10-90mol% of another structural unit of formula II (R3 and R4 are each H, halogen or methyl; R5 is H, halogen, alkyl, etc.). |