发明名称 PROCESS FOR PRODUCING A RESIN BONDED MAGNET STRUCTURE
摘要 A process for producing resin bonded magnet structures is disclosed which includes the steps of: (a) adding a solid epoxy resin of at least one epoxy oligomer and a microcapsule which contains at least one liquid epoxy resin to a melt spun powder of a rare earth element-iron alloy to form a granulated intermediate material, wherein the epoxy oligomer has alcoholic hydroxyl groups in the molecular chain thereof and the solid epoxy resin has a softening temperature (Durran's melting point) of 65 DEG C. to 85 DEG C.; (b) mixing the granulated intermediate material with a powdered curing agent and a lubricant to form a compound; (c) forming a green body of a resin bonded magnet by compressing the compound, and then integrating the green body directly with a supporting member; and (d) curing the solid and liquid epoxy resins in the green body by application of heat to form a rigid structure of the resin bonded magnet integrated with the supporting member.
申请公布号 US5149477(A) 申请公布日期 1992.09.22
申请号 US19920840634 申请日期 1992.02.21
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 YAMASHITA, FUMITOSHI;WATANABE, AKIHIKO;WADA, MASAMI
分类号 H01F1/08;C08L63/00;H01F1/057;H01F41/02;H02K1/02;H02K15/03 主分类号 H01F1/08
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