SOLDER HEAT TEST METHOD FOR PLASTIC SEALED SEMICONDUCTOR DEVICE,申请号JP19910027309-传众专利搜索

首页产品黄页商标征信

会员服务注册登录

法人/股东/高管

发明名称	SOLDER HEAT TEST METHOD FOR PLASTIC SEALED SEMICONDUCTOR DEVICE
摘要
申请公布号	JPH04266045(A)	申请公布日期	1992.09.22
申请号	JP19910027309	申请日期	1991.02.21
申请人	MATSUSHITA ELECTRON CORP	发明人	SUGAWA MANABU
分类号	G01R31/00;G01R31/26;H01L21/66	主分类号	G01R31/00
代理机构		代理人
主权项
地址

您可能感兴趣的专利

CONTENITORE IN MATERIALE SINTETICO PER AUTOVEICOLI.

ANORDNING FOR TENDSPENNINGSFORDELNING I TENDNINGSSYSTEM FOR FORBRENNINGSMOTORER

MEDEL FOR BEKEMPNING AV KOCCIDIOSER OCH HELMINTIASER

POWER SEMICONDUCTING ELEMENT

APPARATUS FOR CUTTING CONTINUOUSLY MOVING BAND OF MATERIAL

GALVANISCHE CEL.

EKSOSANORDNING FOR FORBRENNINGSMOTOR.

HETEROARYL COMPOUNDS AND PHARMACEUTICAL COMPOSITIONS

CIGARETTE FILTER:TWO CONCENTRIC LAYERS OF FIBROUS FILTER MATERIALS SURROUNDED BY POROUS PLUGWRAP PAPER

GGGLOBULIN PHARMACEUTICAL PREPARATION FOR INTRAVENOUS INJECTION

METHOD OF PRODUCING SYNTHETIC RESIN IMPREGNATED LUMBERS

3-FLRORO-5-PEHNYL-1,2-DIHYDRO-3H-1,4-BENZODIAZEPINE DERIVATIVES

MANUFACTURING RESILIENT RESINOUS FLOOR COVEERING

FLUID FLOW WEIGHT MEASURING DEVICE

1-ALKYL-2,3,4,5-TETRA-SUBSTITUTED PYRAZOLIUM SALTS AND HERBICIDAL COMPOSITIONS

TWO CONVEYOR BELTS OF OVERLAPPING PLATES IN VEE FORMATION

ORGANO-TRANSITION METAL COMPOUNDS AND OLEFIN POLYMERISATION CATALYSTS