发明名称 ELECTRON EMISSION ELEMENT INTEGRATED SUBSTRATE
摘要 <p>PURPOSE:To realize an electron emission element integrated substrate having high density and provide a display device having high image quality at low cost by constituting electron emission elements so as to be arranged along hole walls of microscopic holes formed in the substrate, in relation to the electron emission element integrated substrate. CONSTITUTION:A substrate 11 having plural number of microscopic holes 17 extending in the plate thickness direction is provided, and electron emission elements 20 are formed along hole walls of the microscopic holes 17 in the substrate 11. Furthermore, a film body provided with plural number of microscopic holes formed therein by means of anode oxidation treatment can be used as the substrate 11. A metal-insulator-metal type element, an element having a flat electron emission electrode and a leader electrode, a surface conductive type element, an element having the leader electrodes along hole walls in microscopic holes and a conical electron emission electrodes adjacent to the above-mentioned electrodes, an element having a needle shape electron emission element, or even an element in which electron emission electrodes are formed on hole walls in microscopic walls in a pattern shape can work well.</p>
申请公布号 JPH04264337(A) 申请公布日期 1992.09.21
申请号 JP19910026042 申请日期 1991.02.20
申请人 RICOH CO LTD 发明人 YOSHIDA YOSHIHIRO
分类号 H01J1/304;H01J1/312;H01J1/316;H01J29/04;H01J31/12 主分类号 H01J1/304
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