CERAMIC PACKAGE FOR SEMICONDUCTOR DEVICE,申请号JP19910025917-传众专利搜索

首页产品黄页商标征信

会员服务注册登录

法人/股东/高管

发明名称	CERAMIC PACKAGE FOR SEMICONDUCTOR DEVICE
摘要
申请公布号	JPH04264756(A)	申请公布日期	1992.09.21
申请号	JP19910025917	申请日期	1991.02.20
申请人	NEC YAMAGATA LTD	发明人	ONUMA TETSUYA
分类号	H01L23/00	主分类号	H01L23/00
代理机构		代理人
主权项
地址

您可能感兴趣的专利

METHOD AND APPARATUS FOR PROOF PRINTING TEST.

SCREW EXTRUDING MACHINE

IMPROVEMENT RELATING TO ELECTRICAL CONNECTORS

A DATA STORAGE AND RETRIEVAL APPARATUS

CATION EXCHANGE REINFORCED MEMBRANE AND PROCESS

LINKED SWITCHED VIDEO TELEPHONE SYSTEM

IMPROVED NUTRITIONAL FORMULATION FOR THE TREATMENT OF RENAL DISEASE

SILVER HALIDE PHOTOGRAPHIC LIGHT-SENSITIVE MATERIAL CONTAINING ALIPHATIC CARBOXYLIC ESTER

RESIN COMPOSITION

DRIVING MECHANISM FOR THE AXIAL MOVEMENT OF THE FIRST OR BOTH FIRST AND SECOND ROLLERS OF A COUPLE OF REARRANGEABLE ROLLER IN OFFSET PRINTING PRESSES

HEAT TRANSFER SHEET

IDLE EXHAUST GAS RELIEF ARRANGEMENT FOR OUTBOARD MOTOR

PREPARATION OF URETHANE PREPOLYMERS HAVING LOW LEVELS OF RESIDUAL TOLUENE DIISOCYANATE

COLD-FORMED ROCKER ARM WITH BEARING FLANGES AND SPLASH PLATE

COMPUTER DISPLAY WINDOWING SYSTEMS

EXPLOSIONSSVETNINGSMETOD FOER ATT SAMMANFOGA ROER

DETACHABLE LADDER REST