| 摘要 |
PURPOSE:To obtain a semiconductor package in which frequency characteristics are easily regulated at the time of connecting in a cascade, a reduction in size at the time of connecting in cascade can be realized, reductions in package size and package cost are performed. CONSTITUTION:In a package in which a semiconductor chip 8 and a dielectric board 6 formed with a peripheral circuit are placed, a dielectric substrate 21 for finely regulating a frequency characteristic is provided as an outer electrode of the package.
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