| 摘要 |
PURPOSE:To provide a chip carrier having high performance corresponding to multi-terminals, high speed and high power of a semiconductor integrated circuit chip and a low cost. CONSTITUTION:Input/output terminals 3 of a pin shape to become leads of a chip carrier are directly attached to a circuit surface side of an integrated circuit chip 1. A heat spreader 2 to become a chip carrier body is secured to a rear surface side of the chip by soldering, etc. The body is buried with sealing resin as required. Since the terminals of the carrier are directly attached to the surface of the chip, the lengths of the leads are shortened, and a high speed signal transmission is performed. Since the terminals are led from the entire surface of the integrated circuit, multi-terminals can be facilitated. Operability, testing properties, maintenance, reliability, heat dissipation of the circuit of problems of a bare chip can be improved. Since its structure is simple, a low cost can be obtained. |
