| 摘要 |
1. Method of manufacturing a heat sink (10) for semiconductor devices, in particular by extrusion of lightweight metal, with cooling ribs (20) of approximately bar-shaped cross section protruding at a distance from one another from a base plate (11), the base plate (11) being extruded with main grooves (14) and separately manufactured cooling ribs (20) being inserted into the main grooves (14), characterized in that the main grooves (14) are manufactured with ribs (19) flanking them and separating them from intermediate grooves (15) and these ribs (19) are plastically deformed after insertion of the cooling ribs (20) in such a way that the cooling ribs (20) are squeezed-in in the main grooves (14). |
