| 摘要 |
<p>PURPOSE: To provide a method for encapsulating a flip chip integrated circuit which enables removing soldering bump, completely covering a die surface and to maximumly utilizing a region on a substrate. CONSTITUTION: An adhesive material (220) including a fluxing agent and metal particles (240) is applied to either a substrate (200) having a metallization pattern (210) or an electrical component (230). The component (230) is positioned on the substrate (210) and heated. During the heating step, the fluxing agent promotes adhesion of the metal particles (240) to the substrate metallization pattern (210) and the component, and the adhesive material (220) is cured, to mechanically interconnect and encapsulate the substrate (210) and the component (230).</p> |
