发明名称 METHOD OF MELTING INDUCED DIFFUSION BONDING
摘要 In transient liquid phase bonding, activated diffusion brazing method, boron powder of which purity is 99 %, thickness is less than 100 μm, and melting point is higher than that of matrix is used as an insert metal. Adhesion between matrix and insert metal is obtained by heating at 1,100-1,300 deg.C for 6 hrs., in nonoxidative atomsphere, without melting insert boron powder. The above bonding process is simple and reduces adhesion time.
申请公布号 KR920007836(B1) 申请公布日期 1992.09.18
申请号 KR19900009669 申请日期 1990.06.28
申请人 KOREA INSTITUTE OF MACHINERY & METALS 发明人 JONG, JAE - PIL;LEE, BO - YONG
分类号 B23K20/00;(IPC1-7):B23K20/00 主分类号 B23K20/00
代理机构 代理人
主权项
地址