摘要 |
<p>PURPOSE:To enable the protrusion contacts to be formed easily and collectively on a fine terminal electrode by a method wherein the recessions on the surface of a supporting base material are filled up with the metallic paste mainly comprising a low melting point alloy or a metal and then the metallic paste is melted down to form metallic balls which are transferred to the fine terminal electrode surface. CONSTITUTION:The recessions provided on the surface of a supporting base material 1 are filled up with metallic paste 2 mainly comprising a low melting point alloy or a metal by sliding a squeegee. Next, the supporting base material 1 is heated at about 230 deg.C using a heating head 4 to form metallic balls 2C by melting down the filled up metallic paste 2b. Finally, when the electrode pads 6 of an IC chip 5 are oppositely pressure-fixed on the metallic balls 2c, the metallic balls 2c can be transferred only to the electrode pads 6 so as to collectively form the title electric connection contacts 7.</p> |