发明名称 FORMATION OF ELECTRIC CONNECTION CONTACT AND MANUFACTURE OF MOUNTED SUBSTRATE
摘要 <p>PURPOSE:To enable the protrusion contacts to be formed easily and collectively on a fine terminal electrode by a method wherein the recessions on the surface of a supporting base material are filled up with the metallic paste mainly comprising a low melting point alloy or a metal and then the metallic paste is melted down to form metallic balls which are transferred to the fine terminal electrode surface. CONSTITUTION:The recessions provided on the surface of a supporting base material 1 are filled up with metallic paste 2 mainly comprising a low melting point alloy or a metal by sliding a squeegee. Next, the supporting base material 1 is heated at about 230 deg.C using a heating head 4 to form metallic balls 2C by melting down the filled up metallic paste 2b. Finally, when the electrode pads 6 of an IC chip 5 are oppositely pressure-fixed on the metallic balls 2c, the metallic balls 2c can be transferred only to the electrode pads 6 so as to collectively form the title electric connection contacts 7.</p>
申请公布号 JPH04263433(A) 申请公布日期 1992.09.18
申请号 JP19910024425 申请日期 1991.02.19
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 WATANABE HIROTOSHI;HATAKEYAMA AKIHITO;HORIO YASUHIKO
分类号 H01L21/60;H05K3/34 主分类号 H01L21/60
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