| 摘要 |
PURPOSE:To prevent the crack of the semiconductor pellet by forming a plurality of rectangular, wedge-shaped or slit-shaped cutouts at the periphery of the metallic tab for fitting the pellet to absorb the thermal stress occurred at the tab. CONSTITUTION:The tab 10 for fitting the semiconductor pellet 3 is formed integrally with a lead wire 11 as a lead frame, and formed of kovar or an alloy or the like metal. The cutout 13 is formed toward the center at four corners of the rectangular tab 10. The shape of the cutout 13 may be any of wedge-shape, slit-shape and drum-shape. Thus, the thermal stress occurred at the tab due to the thermal expansion difference between the semiconductor silicon and the metal tab is absorbed to prevent the crack of the pellet. |
