| 摘要 |
PURPOSE:To prevent a bridge from being generated between leads by performing solder plating to the leads of a face packaging component with narrow lead pitch previously and soldering a printed board with use of this solder plating. CONSTITUTION:The upper surface of a plate which is not soldered is coated with cream solder according to the leads of the face packaging component and the leads of the face packaging component is mounted on the cream solder, then, the cream solder is melted to plate the leads with solder. |
