| 摘要 |
PURPOSE:To obtain efficiently a resin sealing type semiconductor device which has high reliability and is superior in an external appearance, by a method wherein a mold releasing restoration agent containing much more aliphatic mold release agent than sealing resin beforehand is molded and an aliphatic mold release agent layer is formed. CONSTITUTION:An aliphatic mold release agent layer is formed on the surface of a mold, by molding a mold releasing restoration agent containing much more aliphatic mold release agent than sealing resin beforehand. An epoxy resin composition used ordinarily as the sealing resin contains about 0.2wt.% aliphatic mold release agent. It is preferable that content of the aliphatic mold release agent of the mold releasing restoration agent is 1-2wt.%. For example, montanic acid, stearic acid, a calcium and montanate ester montanate are mentioned as the aliphatic mold release agent. The sufficient aliphatic mold release agent layer can be formed uniformly on the surface of the mold by molding the mold releasing restoration agent by 1-3 shots. |
