| 发明名称 |
Curable resin compositions and semiconductor devices coated and sealed with the same. |
| 摘要 |
<p>A thermosetting resin composition comprising at least a cycloaliphatic ether oligomer represented by the general formula (I): <CHEM> wherein m and n are each 0 to 30 and 2<m+n</=30, and a p-hydroxylstyrene polymer or copolymer represented by the general formula (III): <CHEM> wherein y is H, NH2, SO3H, Br or Cl and r is 5 to 300. The thermosetting resin composition is suitable for coating and sealing semiconductor device and improves heat resistance, humidity resistance and migration resistance of the semiconductor device coated and sealed thereby.</p> |
| 申请公布号 |
EP0503744(A2) |
申请公布日期 |
1992.09.16 |
| 申请号 |
EP19920201125 |
申请日期 |
1987.03.03 |
| 申请人 |
HITACHI, LTD. |
发明人 |
NISHIKAWA, AKIO;KOYAMA, TORU;KANNO, CHIKASHI;SHIBATA, NOBUO;WAJIMA, MOTOYO;TADA, RITSURO;NARAHARA, TOSHIKAZU |
| 分类号 |
C08G59/00;C08G59/02;C08G59/20;C08G59/24;C08G59/32;C08G59/40;C08G59/50;C08G59/62;C08L63/00;H01B3/40;H01B3/44;H01L23/29;H01L23/31 |
主分类号 |
C08G59/00 |
| 代理机构 |
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代理人 |
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