| 摘要 |
PURPOSE:To enable a lead frame to be constituted so that a moment of inertia at a tip of an inner lead becomes large for relaxing vibration which is generated when an ultrasonic bonder is brought into contact with it. CONSTITUTION:A lead frame 2 mainly consists of a die pad 21 for mounting a chip and an inner lead 22. Further, an inner lead 23 is provied with a bonding pad 23 and a weight part 24 in one piece near the tip (at a side closer to a chip 1). When bonding a wire 3 to the lead frame 2, the inner lead 2 is fixed by pressing a part which is closest to the bonding pad 23 with a tool 4 for the lead frame which is placed on a stand. Then, a tip of the wire 3 is welded onto the bonding pad 23 with an ultrasonic bonder. In this case, a moment of inertia at a vibration part of the inner lead 22 is extremely high with a mass of the weight part 24. |
