发明名称 Cladding resin composition.
摘要 <p>The invention relates to a cladding resin composition curable by heat, ultraviolet radiation, an electron beam or the like. The composition comprises a polyoxyalkylene polyol phosphate ester (hydroxyl value: 10-2,000 mg KOH/g) and a polymerizable or reactive functional group-containing compound. This composition is highly conductive as it is and, without incorporation of the conventional conductive additives, can be used successfully in the field of coatings and protective films where electric conductivity is a requisite.</p>
申请公布号 EP0503267(A1) 申请公布日期 1992.09.16
申请号 EP19920101826 申请日期 1992.02.04
申请人 DAI-ICHI KOGYO SEIYAKU CO., LTD. 发明人 SHIRAIWA, TETSUO;MORI, SHIGEO
分类号 C08G18/50;C08G65/327;C08L63/00;C09D133/02;C09D133/04;C09D133/06;C09D135/00;C09D163/00;C09D171/00;C09D171/02;C09D175/08;H01B1/12 主分类号 C08G18/50
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