发明名称 |
Vapor reflow type soldering apparatus |
摘要 |
A vapor reflow type soldering apparatus with an upper supply hole of vapor for heating the upper surface of an article to be processed, the position of which is displaced to the downstream side along a direction of delivery with respect to that of a lower supply hole of vapor for heating the lower surface of the article, so that the temperature of the upper surface of the article to be processed can be raised more moderately than that of the lower surface thereof.
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申请公布号 |
US5146694(A) |
申请公布日期 |
1992.09.15 |
申请号 |
US19900591884 |
申请日期 |
1990.10.02 |
申请人 |
HITACHI TECHNO ENGINEERING CO., LTD. |
发明人 |
MISHINA, HARUO;YAMAMA, SHINYA |
分类号 |
B23K1/015 |
主分类号 |
B23K1/015 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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