发明名称 |
Method for making a thermally enhanced semiconductor device by holding a leadframe against a heatsink through vacuum suction in a molding operation |
摘要 |
A method for making a semiconductor device having a heat sink is provided in which an opening through the heat sink enables a vacuum source to be applied to a semiconductor die mounting surface. In one form, a semiconductor die is attached to a mounting surface of a leadframe. The leadframe also has a plurality of leads which are electrically coupled to the semiconductor die. The semiconductor die and portions of the leads are encapsulated in a package body. Also incorporated into the package body is a heat sink. The heat sink has an opening which extends through the heat sink and exposes a portion of the mounting surface of the leadframe. The opening is used to apply a vacuum to the mounting surface during the formation of the package body so that the mounting surface and heat sink are held in close proximity. The closeness provides a good thermal conduction path from the semiconductor die to the ambient, thereby enhancing the thermal dissipation properties of the device.
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申请公布号 |
US5147821(A) |
申请公布日期 |
1992.09.15 |
申请号 |
US19910786205 |
申请日期 |
1991.10.31 |
申请人 |
MOTOROLA, INC. |
发明人 |
MCSHANE, MICHAEL B.;CASTO, JAMES J.;JOINER, BENNETT A. |
分类号 |
H01L21/56;H01L23/433 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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