| 摘要 |
PURPOSE:To provide a fine pitch of leads and to prevent damage of a semiconductor pellet, the leads or a sealer for sealing them in a semiconductor device in which an outer terminal of the pellet is electrically connected to the leads. CONSTITUTION:In a semiconductor device 1 in which an outer terminal of a semiconductor pellet 3 is electrically connected to leads 21, an insulating resin board 22 for reinforcing a mechanical strength of the leads 21 is provided at least on one surface of the lead 21, a filler 24 for substantially equalizing a linear expansion coefficient of the board 22 to that of the lead 21, the pellet 3 or a resin sealer 7 for sealing them, or approaching it thereto, is provided in the board 22. |
