| 摘要 |
<p>PURPOSE:To obtain a cured material excellent in electronic erosion resistance, heat resistance, electrical insulation, adhesion, hardness, moisture resistance, chemicals resistance, metal plating resistance or the like by allowing to contain a epoxy resin of phenolic polybutadiene. CONSTITUTION:The epoxy resin of phenolic polybutadiene, curing agent and solvent are contained. The epoxy resin is obtained by allowing phenolic polybutadiene to react with an epihalohydrin such as epichlorohydrin. For example, the phenolic polybutadiene is allowed to react with excess mol of the epihalohydrin to OH-equivalent of the phenolic polybutadiene in the presence of a quaternary ammonium salt such as tetramethyl ammonium chloride or alkaline metal hydroxide such as sodium hydroxide. Dicyandiamidimidazole compound, triazine compound or the like is used as a curing agent and ethylcellosolve, isopropylcellosolve or the like is used as a solvent.</p> |
