| 摘要 |
<p>PURPOSE:To provide a wafer chuck apparatus which can employ both vacuum and electrostatic chuck, by mounting two oscillators on a chuck surface, transferring an oscillation from a first oscillator through a wafer as a medium to a secondary oscillator, and observing conditions on a chuck surface by use of a received wave at the secondary oscillator. CONSTITUTION:An oscillator 16 is buried entirely in an arm 12 except for the top face thereof, wherein the top face is made flush with the top face of a chuck mechanical section 13 so that the top face of the oscillator 16 also constitutes a part of wafer chuck surface. Also, a ceramic oscillator 17 is set at a position closer to the end of an arm 13 than a chuck mechanism 15, wherein the top face of the oscillator 17 is make flush with that of a chuck mechanism 14 so as to constitute a part of the wafer chuck surface. When a normal wafer is normally taken up by the chuck, an oscillation is transferred with a given impedance for a normal wafer from the oscillator 16 to the oscillator 17.</p> |
