| 摘要 |
PURPOSE:To realize flattening of each layer and facilitate each process control during the photosensitive processing of an organic insulating material for a multilayer printed wiring board. CONSTITUTION:An insulating resin layer 13 is formed on the entire part of one main surface of a substrate 11 including metal pattern 12. A flattening resist 14 is further formed thereon as a flat layer and the surface thereof is scaned by the excimer laser beam 15. Thereby, etching for the entire part of resist layer 14 and selective etching of an insulating resin 13 on the metal pattern 12 become possible to realize flattening. |
