| 摘要 |
PURPOSE:To accurately and easily give resin covers to both the front and rear surfaces of a supporting plate having heat radiation to which a semiconductor chip is to be fixed. CONSTITUTION:A lead frame 1 comprising a plurality of supporting plates 2 and external leads 3 is prepared first. A plurality of the supporting plates 2 are mutually connected with insulating bonding members 9 for preventing the tilt of supporting plates. In addition to the external leads 3, a fluidized resin is applied to the insulating bonding members 9 while it is being held by a forming mold 14. Thereafter, part of the insulating bonding member 9 is cut off for obtaining a plurality of independent semiconductor apparatuses. |
