FLIP-CHIP PACKAGE FOR INTEGRATED CIRCUIT USE

摘要

PURPOSE: To provide a flip-chip package for an integrated circuit that is protected from external environment and can be removed. CONSTITUTION: A flip-chip 120 has an arrangement of a raised pad 126 at its bottom surface and is surely connected to an extremely thin-chip carrier 110, due to the engagement of the arrangement of a conductive through-hole 118 on the chip carrier 110 and a raised pad 125. The chip carrier 110 has the arrangement of contact raised pads that correspond to the raised pads 126 of the flip chip 120 on its reverse side. An epoxy protective layer is formed on the upper part of an assembly between the flip chip 120 and the chip carrier 110 and on the exposed surface of the flip chip.