| 摘要 |
PURPOSE:To make the moistureproofness of the title chip excellent and to make the reliability of the grounding property of a die pad high, regarding a structure and a mounting method by which the semiconductor chip is surface- mounted on a circuit board. CONSTITUTION:The title structure and the title method are constituted so as to be provided with the following: a circuit board 10 to which a die pad 15 formed on a mounting face and a whole-face grounding pattern 12 formed on the rear are connected via a through hole 50 formed inside a die pad region; a semiconductor chip 20 which has been die-bonded to the die pad 15 via a conductive adhesive 16, which has been surface-mounted on the circuit board and whose surface side has been sealed with a resin; a metal case 1 which houses the circuit board 10 by soldering important parts of the whole-face grounding pattern 12 to a case bottom plate 1A; and a synthetic resin 60 which has been filled into and bonded to the lower-part opening part of the through hole 50. |
