| 摘要 |
<p>A multilayer structure with a first electrically conductive pattern (2); an insulative layer (4) formed over the first electrically conductive pattern (2); a second electrically conductive pattern (3) formed on said insulative layer (4); and an electrically conductive pin (5) piercing the insulative layer (4) so as to connect said first (2) and second (3) electrically conductive layers, an end (5A) of said pin (5) being cold-welded to said first electrically conductive pattern (2), another end (5B) of said pin (5) contacting said second electrically conductive pattern (3). A method of fabricating such a structure, in which the insulative layer (4) may be of organic resin which is hardened after piercing by the pin (5). <IMAGE></p> |
