| 摘要 |
<p>PURPOSE:To provide an outer lead connection structure where a solder bridge is hardly generated between leads so as to constitute the electronic component mounting board of an electronic component package. CONSTITUTION:Pads 14 provided to conductor circuit layers are alternately located, outer leads 15 are formed independent of the pads 14 and bent enabling the joints of the leads 15 to be located corresponding to the pads 14 respectively, and the joints and the pads 14 are connected to each other with solder 16.</p> |
