HYBRID INTEGRATED CIRCUIT

摘要

PURPOSE:To enable an optical element and other elements to be mixedly mounted on the same circuit board without deteriorating the elements in characteristics by a method wherein the front and the rear side of a circuit board are separately molded up with resins different from each other in optical properties. CONSTITUTION:An optical first active element 5 and an optical passive element 8 are mounted on the front side of a circuit board 4 fixed to a lead frame 1 and molded with a first light transmitting resin 9. A non-optical second active element 6 and a non-optical passive element 8 are mounted on the rear side of the circuit board 4 and molded with a second opaque resin 10.