| 摘要 |
PURPOSE:To provide a reduction projection exposure apparatus and projection exposing method which can reduce the operating time. CONSTITUTION:In a reduction projection exposure apparatus provided with a projecting optical section 4 which radiates a semiconductor wafer 10 mounted on a stage 6 with rays of light emitted from a light source 1 and passed through a convergent lens 2 and reticle 3 and an alignment section 5 which aligns the wafer 10 with the optical section 4, two stages 6-1 and 6-2 are provided in correspondence with the sections 4 and 5. Then, while the wafer 10 mounted on the stage 6-1 is irradiated with the rays of light passed through the reticle 3, another wafer 10 mounted on the other stage 6-2 is positioned by means of the alignment section 5. |
