| 摘要 |
PURPOSE:To provide a sorting method for semiconductor chips wherein the outer circumferential side surface of a semiconductor wafer is coated with a resin layer containing iron powder, the wafer is divided into chips and defective chips on the periphery are attracted by a magnet in order to separate and sort. CONSTITUTION:A plurality of wafers 1 are piled and bonded to form a unit 2, whose outer side surface is coated with a resin layer 3 containing a large quantity of iron powder, and the resin layer is hardened. The unit is divided into small segments each having a square cross-section to obtain good chips 4 and defective chips 4'. Because the chips 4' defective in shape are inevitably coated with the resin containing ion powder, they can be readily separated and sorted by a magnet 5. |
