| 摘要 |
PURPOSE:To make it possible to cut fine patterns without damaging an insulation film and an internal layer pattern with regards to a pattern cutting method of a printed circuit board and a peel-off jig used for said method. CONSTITUTION:A peel-off jig 3 is welded with a conductor 2 in a cut-off part on a printed wiring board 1, and then the aforesaid peel-off jig 3 is raised in such a fashion that the aforsaid conductor 2 in the cut-off part may be separated. The peel-off jig 2 is lifted at the cut-off part conductor 2 on the printed wiring board 1. There are installed a bonding tool 7 which bonds a bonding wire 6 with the conductor 2 at the cut-off part and a pad stopper 5 laid out so as to surround a bonding chip 8 for the aforesaid bonding tool 7 wherein the pad stopper 5 is adapted to remain on an effective pad section 4 which surrounds the conductor 2 to be cut off. |
