SOLDER SUPPLY DEVICE FOR DIE BONDER

摘要

PURPOSE:To prevent an oxide film from being formed on a surface of a solder material by making connection to a transport with a non-oxidation environment through a solder material supply window and then providing a cylinder for presenting oxidation which surrounds the solder material in a specified standby position with the non-oxidation environment. CONSTITUTION:A solder wire 2 and a solder material 2a which is fed from a nozzle tip in a specified standby position are supplied from a spool 4. Also, a lead frame 3 is subjected to pitch feed within a transport path 12 within a non-oxidation environment and an island is placed directly below a nozzle 8 at the time of preforming the solder material. A cylinder for preventing oxidation 18 is connected to the transport path 12 through a solder material supply window 17 which is provided at an upper cover 10 of the transport path. A height of the cylinder for preventing oxidation 18 is set so that the solder material 2a which is fed from an ascent limit position of the nozzle 8 and is in standby can be stored within the inside.