| 摘要 |
PURPOSE:To enhance productivity by connecting a specified multilayer board with a sub-multilayer board whose area is divided. CONSTITUTION:After a plurality of small area sub-multilayer boards 11 and 12 where electrode pads 11d and 12d are formed respectively at a specified position in the proximity in its peripheral area are bonded with each other on their end face region, each of the equivelent electrode 11d and 12d are electrically connected so that a multilayer board 15 may be obtained, which is large in area and specified in size as well. It is, therefore, possible to obtain the speficied multilayer board 15 which is free of failure or defect by processing only such sub-boards 11 and 12, which correspond to the positions of failures and defects exisiting on a large-sized multilayer board 15 targeted as failures. This construction makes it possible to eliminate the need to repair the multilayer board 15 itself as a target failure enhance productivity. |
