| 摘要 |
PURPOSE:To allow a large current to flow into a semiconductor element by forming a heat radiating plate bending along a plurality of external surface of a sealing resin within a sealing resin portion. CONSTITUTION:A heat radiating plate 3 connected with a semiconductor element mounting portion 1 is formed within a sealing resin part 20 bending along a plurality of external surface of this sealing resin portion 20. By forming the heat radiating plate 3, the surface area of heat radiating plate 3 becomes wider and moreover is located in the vicinity of the external surface of the sealing resin portion 20, realizing improvement of heat radiating capability. Thereby, a higher level current can be applied to the semiconductor element 10 without increasing the size of the resin sealing portion 20. |
