| 摘要 |
PURPOSE:To stabilize die bonding characteristics, and cope with various kinds of lead frames, by installing inert gas jetting vents constituted of porous member material, at the position surrounding a die bonding stage, and uniformly supplying the inert gas to the die bonding stage from the whole direction. CONSTITUTION:Porous ceramics 5 having a lot of fine holes is installed at the position surrounding a die bonding stage 3, and uniformly supplies inert gas 6 to the die bonding stage 3 from the whole direction. Thereby solder bonding characteristics of the rear of a semiconductor chip 8 and an island 7 of a lead frame are improved. Installation domain of the porous ceramics 5 can be enlarged as compared with a single hole. Thereby the interception for jetting vents 2 occurring by the island 7 of the lead frame and a lead frame pressing jig can be prevented. The above method can be applied to various kinds of lead frames of different size.
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