PHOTOSENSITIVE POLYIMIDE COMPOSITIONS

摘要

New photosensitive polyimide compositions and processes of using the same in the fabrication of electronic components are provided. These compositions are comprised of (CF3)2C-(6F) containing polyamic acids and/or the corresponding hydroxy-polyamic esters, or hydroxypolyimides and a photoactive component as an additive or as covalently bonded functionality on the polymer chain. These compositions provide positive or negative patterning options and may be used as conventional resist materials, as imageable dielectric or passivating layers,as high Tg ion implant as imageable lift-off layers inthe fabrication of multilevel metal structures.