| 摘要 |
PURPOSE:To make it possible to supply a power supply from an arbitrary power supply pad of power supply pads and to obtain a master slice system semiconductor integrated circuit on a chip, whose size can be made small, by a method wherein the power supply pads are respectively arranged between signal pads to correspond to external cells. CONSTITUTION:Signal pads 4 to correspond to an external cell region 7 within a chip and power supply pads 5 to supply a power supply corresponding to the boundaries between external cells are alternately arranged. Here, the pads 4 and the pads 5 are arranged so as to have a zigzag positional relation and the intervals between the pads, which are needed for a wire bonding, are obtained by ensuring the arrangement intervals between the pads in the oblique direction. Thereby, in the case the power supply of a power supply wiring 1 is supplied to the external cells 9, the power supply can be supplied from the power supply pad to correspond to the boundary between the arbitrary external cell, which requires the power supply of the wiring 1, and its adjacent external cell 9 and a potential drop due to a wiring resistance can be reduced. |
