| 摘要 |
PURPOSE:To provide large capacity and reduce wiring space so as to transfer a signal at a high speed by layering a plurality of memory LSI chips on a printed board and directly connecting conductor leads of common electrodes between the layered chips. CONSTITUTION:A memory circuit of an IC memory card is constituted of a plurality of memory LSI chips 6, 6' consisting of a number of groups of two layers of RAM chips of the same kind mounted on a printed wiring board. The memory LSI chip 6 is layered on other memory LSI chip 6' in a direction that respective electrode arrangements become the same, and end parts 12a, 12a' of conductor leads 12, 12' are connected by common electrodes 10, 10' of the LSI chips 6, 6' through a metallic protrusion 11. Intermediate parts 12b, 12b' and other end parts 12c, 12c' of the conductor leads 12, 12' are connected by insulating films 15, 15'. Lengths between the intermediate parts 12b, 12b' and the other end parts 12c, 12c' are made to be shorter according as the layer becomes lower. |
