| 摘要 |
PURPOSE:To provide a method for manufacturing a ceramic printed circuit board having a high reliability of electrical connection of conductor vias to pads. CONSTITUTION:An inspection step 30 of inspecting ceramic boards themselves includes a step 31 of transferring the qualities of conductor vias to a transfer body, and a step 32 of determining the acceptance of the board by inspecting the transfer body to which the qualities of the vias are transferred. The qualities of the vias are transferred to the transfer body in a prominent state. |
