| 摘要 |
PURPOSE:To obtain high sensitivity and sufficient photosetting speed only by adding a necessary amount of photosensitive resin composition. CONSTITUTION:The photosensitive resin composition is composed essentially of A a compound having an ethylenically unsaturated group, B a photopolymerization initiator, and C a polymer having a structure represented by formula I in which each of R1 and R2 is independently H or 1-10 alkyl; and R3 is a 1-10 C divalent hydrocarbon group optionally having at least one of ester, ether, and urethane bonds in the chain. For example, the photosensitive resin composition comprises 100 pts.wt. of one or more kinds of the compounds each having the ethylenically unsaturated bond, preferably, 1-500 pts.wt. of organic polymer, 1-50 pts.wt. of the photopolymerization initiator, and 1-50 pts.wt. of the polymer having the structure represented by formula I. |
