发明名称 |
Method of assembling compact silicon module for high density integrated circuits |
摘要 |
A semiconductor module that densely packs integrated circuit chips to provide electronic systems or large memory modules in an array of stacked silicon boards. The semiconductor chips may be flip mounted and the back side of each chip is in thermal contact with an adjacent silicon board to provide heat conduction away from the chip. |
申请公布号 |
US5144746(A) |
申请公布日期 |
1992.09.08 |
申请号 |
US19910698507 |
申请日期 |
1991.05.10 |
申请人 |
TEXAS INSTRUMENTS INCORPORATED |
发明人 |
MCDAVID, JAMES M. |
分类号 |
H01L23/538;H01L25/065 |
主分类号 |
H01L23/538 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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