发明名称 METHOD FOR MULTIMOLDING OF MOLDED PART IN ELECTRONIC COMPONENT LEAD FRAME
摘要 PURPOSE:To reduce cost required for molding of a molded part and to uniform quality by sliding a lead frame off by an appropriate dimension in the longitudinal direction of the lead frame. CONSTITUTION:When arranged in parallel between a lower die 11 and an upper die, the lead frames A, B are slid off each other in the longitudinal direction by appropriate dimension L. Then, the cast opening 16a of each molding cavity 16 of one lead frame A and the cast opening 17a of each molding cavity 17 of the other lead frame B approaches each other along the longitudinal direction of the lead frames A, B; therefore, runners 18, 19 which connect each stock tablet filling chamber 13 to cast openings 16a, 17a of the respective molding cavities 16, 17 in the lead frames A, B can be shortened markedly.
申请公布号 JPH04251943(A) 申请公布日期 1992.09.08
申请号 JP19910012927 申请日期 1991.01.09
申请人 ROHM CO LTD 发明人 NISHIMURA HIROYUKI
分类号 H01L21/56;B29C45/02;B29C45/14;B29C45/27;B29L31/34 主分类号 H01L21/56
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