| 摘要 |
PURPOSE: To provide a package for a semiconductive device, especially advantageous for a power diode, by improving heat transmission performance and power capacity. CONSTITUTION: In the package for a semiconductive device formed on a semiconductor die 18, a tubular carrier member 11 made of copper having a groove 17 and round shoulder parts 16 is employed. The die 18 is secured, on one side thereof, into the groove through a solder 19 placed between the die and the bottom of the groove. A cap member 12 is arranged to be fitted in the groove and has a bottom part 14 providing a solderable surface. The cap member 12 is soldered by solder 100 to the other side of the die 18. The gap between the cap member 12 and the carrier member 11 is filled with a filling resin. |
