PATTERN WIDTH MEASURING METHOD FOR PRINTED WIRING BOARD

摘要

PURPOSE:To provide a printed-wiring board pattern width measuring method capable of measuring the width of the base of a copper foil pattern, the width between the copper foil patterns, and the width of the top part of the copper foil pattern with high accuracy. CONSTITUTION:The laser light (b) projected to the surface on the side of the copper foil pattern 1B of a printed-wiring board 1 to be measured is reflected from the portion to be measured, and electromagnetic waves of a fixed wavelength emit fluorescene X-rays from the portion to be measured. A signal processing unit measures the width of the copper foil pattern 1B from the fluorescene X-rays (a) emitted from the base material 1A of the printed-wiring board 1 to be measured. With reflected waves (c) of the laser light (b), the side wall part and the nearly flat top face of the copper foil pattern 1B are different from each other in the amount of light. The signal processing unit measures the width of the top face of the copper foil pattern 1B from the difference in the amount of light.