| 摘要 |
PURPOSE:To accurately set the feed position of a wire and to reduce the size of a pressure face to a minimum regarding the wire bonding method and the bonding tool of various kinds of printed wiring boards which are used widely when various kinds of electronic apparatuses are constituted. CONSTITUTION:A clamper 14 which grips the tip of a wire 1 fed form a hole for wire feed use at a bonding tool 13 and which energizes a tension onto said wire 1 is installed on the side opposite to said hole for wire feed use. Said wire 1 onto which the tension has been energized by using said clamper 14 is bonded to a pad on a substrate by using the pressure face of said bonding tool 13. |
